Suzhou Delphi Laser Co., Ltd. engages in the research, development, manufacture, and sale of industrial precision laser processing equipment and lasers in China and internationally. The company offers laser scribing, laser grooving, silicon carbide ingot slicing, silicon carbide laser annealing, and laser blind dicing equipment for various wafer materials; laser cutting, marking, drilling, etching, and welding services for materials; cover plates, carbon fiber, metal hinges, OLED screens, circuit boards, and automation products; front-end lithium battery process solutions and mid-to-back-end lithium battery laser solutions; and laser wafer milling equipment, laser blue film/adhesive removal equipment, and automatic milling and peeling equipment for pack water-cooled plates. It also provides front-end P0 laser marking equipment; P1, P2, and P3 laser scribing equipment; P4 laser edge cleaning equipment; transmission and buffer lines; automated equipment for back-end encapsulation and testing; and laser mold making and butyl adhesive application equipment. In addition, the company offers nanosecond, picosecond, femtosecond, and tunable pulse width solid-state lasers; optical fiber and high-power semiconductor lasers; mechanical and optical module solutions; laser processing services, including PCB separation, ball bonding, and silicon photonics chip bonding, as well as automated dispensing and assembly, sorting, AOI inspection, and testing solutions; a complete set of motion platforms and control modules, including gantry dual-drive platforms, multi-axis stacked platforms, and high-precision single-axis modules; and automated production and testing line solutions. Its products are used in semiconductors, electronics, photovoltaic, lithium batteries, display, and scientific research applications. Further, the company engages in investment activities. Suzhou Delphi Laser Co., Ltd. was incorporated in 2005 and is headquartered in Suzhou, China.
