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LEND

SEI High Yield Bond & Alternative Credit ETF

LEND US
$24.655+$0.005  (0.02%)
Dividends
Dividend yield
5.89%
Annual payout
$1.45
Next ex. div date
September 3, 26
About the company
Ticker
LEND
ISIN
Country
Other
Sector (GICS)
Other
Under normal circumstances, the SEI High Yield Bond & Alternative Credit ETF will invest at least 80% of its net assets (plus the amount of any borrowings for investment purposes) in high yield fixed income and, to a lesser extent, alternative credit securities, as those terms. It will invest primarily in securities rated BB, B, CCC, CC, C and D. However, it may also invest in non-rated securities or securities rated investment grade (AAA, AA, A and BBB).

Frequently asked questions

What is SEI High Yield Bond & Alternative Credit ETF (LEND) current stock price?

As of the latest data, SEI High Yield Bond & Alternative Credit ETF stock price is $24.66, with a previous close of $24.65. SEI High Yield Bond & Alternative Credit ETF gained $0.01 in the last trading session, representing a 0.02% increase.

Does SEI High Yield Bond & Alternative Credit ETF (LEND) pay dividends?

Yes. SEI High Yield Bond & Alternative Credit ETF pays monthly dividends with an annualized yield of 5.89% and an estimated annual payout of $1.45 per share.

When is the next ex-dividend date for SEI High Yield Bond & Alternative Credit ETF (LEND)?

The next ex-dividend date is scheduled for September 03, 2026.